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Effect of Microstructure on the Electro-Mechanical Behaviour of Cu Films on Polyimide

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Marx,  Vera Maria
Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Kirchlechner,  Christoph
Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, Leoben, Austria;
Department Material Physics, Montanuniversität Leoben, Jahnstr. 12, Leoben, Austria;
Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Citation

Berger, J., Glushko, O., Marx, V. M., Kirchlechner, C., & Cordill, M. J. (2016). Effect of Microstructure on the Electro-Mechanical Behaviour of Cu Films on Polyimide. JOM-Journal of the Minerals Metals & Materials Society, 68(6), 1640-1646. doi:10.1007/s11837-016-1940-z.


Cite as: http://hdl.handle.net/11858/00-001M-0000-002D-BE84-1
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