English
 
Help Privacy Policy Disclaimer
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT
Add to Basket
  Local TagsRelease HistoryDetailsSummary

Released
Poster

Thermal stability of titanium nitride diffusion barrier films for advanced silver interconnects

MPS-Authors
/persons/resource/persons108606

Balden,  M.       
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons109819

Linsmeier,  C.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons110800

Wiltner,  A.
Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society;

External Resource
No external resources are shared
Fulltext (restricted access)
There are currently no full texts shared for your IP range.
Fulltext (public)
There are no public fulltexts stored in PuRe
Supplementary Material (public)
There is no public supplementary material available
Citation

Gao, L., Gstöttner, J., Emling, R., Balden, M., Linsmeier, C., Wiltner, A., et al. (2004). Thermal stability of titanium nitride diffusion barrier films for advanced silver interconnects. Poster presented at Materials for Advanced Metallization (MAM 2004), Brussels.


Cite as: https://hdl.handle.net/21.11116/0000-0000-07D9-4
Abstract
There is no abstract available