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Conference Paper

High Temperature Creep of Microcrystalline Dispersion Strengthened Copper Alloys

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Dehm,  Gerhard
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Mayer,  Joachim
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Citation

Sauer, C., Weißgärber, T., Püsche, W., Dehm, G., Mayer, J., & Kieback, B. F. (1996). High Temperature Creep of Microcrystalline Dispersion Strengthened Copper Alloys. In T. Cadle, & K. S. Narasimhan (Eds.), Advances in Powder Metallurgy and Particulate Materials - 1996: Proceedings of the 1996 World Congress on Powder Metallurgy & Particulate Materials Sponsored by the Metal Powder Industries Federation and APMI International (pp. 14-81-14-94). New York, NY, USA: Princeton, NJ; Metal Powder Industries Federation; APMI International.


Cite as: http://hdl.handle.net/21.11116/0000-0001-99B9-2
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