Yield stress influenced by the ratio of wire diameter to grain size – a 
competition between the effects of specimen microstructure and dimension in 
micro-sized polycrystalline copper wires

Yang, Bo; Motz, Christian; Rester, Martin; Dehm, Gerhard

doi:10.1080/14786435.2012.693215

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Yield stress influenced by the ratio of wire diameter to grain size – a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires

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Yang, B., Motz, C., Rester, M., & Dehm, G. (2012). Yield stress influenced by the ratio of wire diameter to grain size – a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires. Philosophical Magazine Letters; Nano-mechanical testing in materials research and development III, 92(25-27), 3243-3256. doi:10.1080/14786435.2012.693215.

Cite as: https://hdl.handle.net/21.11116/0000-0001-8BD9-E

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