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Journal Article

Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide

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Cordill, M. J., Taylor, A. A., Schalko, J., & Dehm, G. (2011). Microstructure and adhesion of as-deposited and annealed Cu/Ti films on polyimide. International Journal of Materials Research, 102(6), 729-734. doi:10.3139/146.110513.


Cite as: https://hdl.handle.net/21.11116/0000-0001-9079-4
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