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Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing

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Huang, R., Robl, W., Ceric, H., Detzel, T., & Dehm, G. (2010). Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing. IEEE Transactions, 10(1), 47-54. doi:10.1109/TDMR.2009.2032768.


Cite as: https://hdl.handle.net/21.11116/0000-0001-94F7-1
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