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Bonding at copper-alumina interfaces established by different surface treatments: a critical review

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Scheu,  Christina
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;
Department Physical Metallurgy and Materials Testing, Montanuniversität Leoben, Franz-Josef-Str. 18, 8700 Leoben, Austria;

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Gao,  Min
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;
Department of Electrical and Computer Engineering, Ohio State University, Columbus, OH 43210, USA;

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Oh,  Sang Ho
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;
Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Department Materials Physics, Montanuniversität Leoben, Jahnstrasse. 12, 8700 Leoben, Austria;

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Dehm,  Gerhard
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Leoben, Austria;
Department of Materials Physics, Montanuniversität Leoben, Austria;

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Klein,  Saskia
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Rühle,  Manfred
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Citation

Scheu, C., Gao, M., Oh, S. H., Dehm, G., Klein, S., Tomsia, A., et al. (2006). Bonding at copper-alumina interfaces established by different surface treatments: a critical review. Journal of Materials Science, 41(16), 5161-5168. doi:10.1007/s10853-006-0073-0.


Cite as: https://hdl.handle.net/21.11116/0000-0001-9811-0
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