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Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates

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Schmidt,  Tobias
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Balk,  Thomas John
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Dehm,  Gerhard
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Arzt,  Eduard
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Schmidt, T., Balk, T. J., Dehm, G., & Arzt, E. (2004). Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia, 50(6), 733-737. doi:10.1016/j.scriptamat.2003.11.039.


Cite as: http://hdl.handle.net/21.11116/0000-0001-97F0-5
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