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Journal Article

In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate

MPS-Authors
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Dehm,  Gerhard
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Weiss,  Dirk
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Arzt,  Eduard
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Universität Stuttgart, Institut für Metallkunde;

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Dehm, G., Weiss, D., & Arzt, E. (2001). In situ transmission electron microscopy study of thermal-stress-induced dislocations in a thin Cu film constrained by a Si substrate. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing, 309-310, 468-472. doi:10.1016/S0921-5093(00)01703-2.


Cite as: https://hdl.handle.net/21.11116/0000-0001-9600-5
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