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Pathways for reliable lead-free solder joints: micro-fracture properties of Au-Sn based solder

MPS-Authors
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Du,  Chaowei
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Soler,  Rafael
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Kirchlechner,  Christoph
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Dehm,  Gerhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Citation

Du, C., Soler, R., Matoy, K., Zechner, J., Langer, G., Kirchlechner, C., et al. (2018). Pathways for reliable lead-free solder joints: micro-fracture properties of Au-Sn based solder. Talk presented at European solid mechanics conference (ESMC) 2018. Bologna, Italy. 2018-07-02 - 2018-07-06.


Cite as: http://hdl.handle.net/21.11116/0000-0001-D819-0
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