High Temperature Creep of Microcrystalline Dispersion Strengthened Copper Alloys

Sauer, Christa; Weißgärber, Thomas; Püsche, Wolfgang; Dehm, Gerhard; Mayer, Joachim; Kieback, Bernd F.

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High Temperature Creep of Microcrystalline Dispersion Strengthened Copper Alloys

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Dehm, Gerhard
Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Mayer, Joachim
Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Sauer, C., Weißgärber, T., Püsche, W., Dehm, G., Mayer, J., & Kieback, B. F. (1997). High Temperature Creep of Microcrystalline Dispersion Strengthened Copper Alloys. International Journal of Powder Metallurgy, 33(1), 45-53.

引用: https://hdl.handle.net/21.11116/0000-0001-957D-B

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