Comparison between the interfacial chemistry of metallized polyimides and 
polyimide films on bulk metal substrates

Grunze, M.; Killinger, A.; Thümmler, C.; Hahn, C.; Strunskus, T.

doi:10.1007/978-1-4899-0735-6_13

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Comparison between the interfacial chemistry of metallized polyimides and polyimide films on bulk metal substrates

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Grunze, M.
Cellular Biophysics, Max Planck Institute for Medical Research, Max Planck Society;

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Citation

Grunze, M., Killinger, A., Thümmler, C., Hahn, C., & Strunskus, T. (1991). Comparison between the interfacial chemistry of metallized polyimides and polyimide films on bulk metal substrates. In K. L. Mittal (Ed.), Metallized Plastics 2: Fundamental and Applied Aspects (pp. 165-177). Boston, MA: Springer.

Cite as: https://hdl.handle.net/21.11116/0000-0001-95E4-5

Abstract

In this short overview the pertinent differences in the chemical interaction in differently prepared polyimide/metal interfaces are summarized. Considered are the cases of metals (Cr, Cu) deposited onto cured polyimide surfaces, interfaces prepared by spin coating polyamic acid onto a bulk substrate and subsequent thermal imidization, vapor deposited polyamic acid on bulk substrates (Cu, Ag, Si, Cr) with subsequent thermal imidization, and deposition of polyamic acid in the form of mono- and multilayers by Langmuir-Blodgett (LB) techniques onto a Si (100) surface. New FTIR and XPS data are discussed for copper deposition onto polyimide.