Interaction of evaporated copper with vapor‐deposited thin polyimide films

Strunskus, T.; Grunze, M.; Hahn, C.; Frankel, D.

doi:10.1116/1.577611

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Interaction of evaporated copper with vapor‐deposited thin polyimide films

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Grunze, M.
Cellular Biophysics, Max Planck Institute for Medical Research, Max Planck Society;

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Citation

Strunskus, T., Grunze, M., Hahn, C., & Frankel, D. (1991). Interaction of evaporated copper with vapor‐deposited thin polyimide films. Journal of Vacuum Science and Technology A: Vacuum, Surfaces, and Films, 9(3), 1272-1277. doi:10.1116/1.577611.

Cite as: https://hdl.handle.net/21.11116/0000-0001-9617-C

Abstract

The interaction of evaporated copper deposits with vapor‐deposited, vacuum‐cured thin films of pyromellitic dianhydride‐oxydianiline (PMDA‐ODA) polyimide was studied using x‐ray photoelectron spectroscopy (XPS) and Fourier transform infrared reflection absorption spectroscopy (FTIRAS). XPS and FTIRAS measurements indicate a preferential interaction of the copper with the imide part of the molecule, some interaction with the ODA ether oxygen and only a very weak interaction with the phenyl rings. The spectral changes observed show a dependence on the rate of the copper deposition.