English
 
User Manual Privacy Policy Disclaimer Contact us
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT

Released

Talk

Mechanical characterization of copper thin films produced by photolithography with a novel microscale high temperature loading rig

MPS-Authors
/persons/resource/persons211327

Arigela,  Viswanadh Gowtham
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons125219

Kirchlechner,  Christoph
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons75388

Dehm,  Gerhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

External Ressource
No external resources are shared
Fulltext (public)
There are no public fulltexts stored in PuRe
Supplementary Material (public)
There is no public supplementary material available
Citation

Arigela, V. G., Oellers, T., Ludwig, A., Kirchlechner, C., & Dehm, G. (2018). Mechanical characterization of copper thin films produced by photolithography with a novel microscale high temperature loading rig. Talk presented at The International Conference on Experimental Mechanics, (ICEM) 2018. Brussels, Belgium. 2018-07-01 - 2018-07-05.


Cite as: http://hdl.handle.net/21.11116/0000-0005-4715-4
Abstract
There is no abstract available