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Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior

MPS-Authors
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Du,  Chaowei
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Soler,  Rafael
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Völker,  Bernhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Materials Chemistry, RWTH Aachen University, Aachen, Germany;

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Kirchlechner,  Christoph
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Dehm,  Gerhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Citation

Du, C., Soler, R., Völker, B., Matoy, K., Zechner, J., Langer, G., et al. (2019). Au–Sn solders applied in transient liquid phase bonding: Microstructure and mechanical behavior. Materialia, 8: 100503. doi:10.1016/j.mtla.2019.100503.


Cite as: http://hdl.handle.net/21.11116/0000-0005-7278-4
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