English
 
Help Privacy Policy Disclaimer
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT

Released

Journal Article

The effect of different concentrations of chloride on the structure of Cu UPD on Pt(111)

MPS-Authors
/persons/resource/persons22283

Zei,  Mau-Scheng
Physical Chemistry, Fritz Haber Institute, Max Planck Society;

/persons/resource/persons249327

Wu,  Kai
Physical Chemistry, Fritz Haber Institute, Max Planck Society;

/persons/resource/persons21488

Eiswirth,  Markus
Physical Chemistry, Fritz Haber Institute, Max Planck Society;

/persons/resource/persons21498

Ertl,  Gerhard
Physical Chemistry, Fritz Haber Institute, Max Planck Society;

External Resource
No external resources are shared
Fulltext (restricted access)
There are currently no full texts shared for your IP range.
Fulltext (public)
There are no public fulltexts stored in PuRe
Supplementary Material (public)
There is no public supplementary material available
Citation

Zei, M.-S., Wu, K., Eiswirth, M., & Ertl, G. (1999). The effect of different concentrations of chloride on the structure of Cu UPD on Pt(111). Electrochimica Acta, 45(4-5), 809-817. doi:10.1016/S0013-4686(99)00259-5.


Cite as: https://hdl.handle.net/21.11116/0000-0008-F736-5
Abstract
The influence of the concentration of chloride ions on the underpotential deposition of copper onto Pt(111) has been studied by AES, LEED and RHEED. The results demonstrate that the arrangements of the superlattices of (2×), ‘(4×4)’, c(11×3) and (1 8 2 1), and their packing density on the copper covered Pt(111) are clearly determined by the Cl- concentration. The real space structures of the corresponding LEED/RHEED patterns are derived from a comparison of the LEED spot intensities with those obtained by kinematic calculations. Thus the superstructures are interpreted as ordered Cl adlayers on top of a pseudomorphic-grown Cu UPD layer. A compressed copper UPD adlayer with a Cu-Cu distance of 0.259 nm determined by EXAFS could not be observed by RHEED.