Micromachining of Al2O3 thin films via laser drilling and plasma etching for 
interfacing copper

Dogan, G.; Chiu, F.; Chen, S. U. H.; David, M. R. T.; Michalowski, A.; Schänzel, M.; Silber, C.; Schütz, G.; Grévent, C.; Keskinbora, K.

doi:10.1016/j.matdes.2021.110114

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Micromachining of Al₂O₃ thin films via laser drilling and plasma etching for interfacing copper

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Dogan, G.
Dept. Modern Magnetic Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Robert Bosch GmbH, Automotive Electronics;

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Schütz, G.
Dept. Modern Magnetic Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Keskinbora, K.
Dept. Modern Magnetic Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;
Massachusetts Institute of Technology;

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Dogan, G., Chiu, F., Chen, S. U. H., David, M. R. T., Michalowski, A., Schänzel, M., et al. (2021). Micromachining of Al₂O₃ thin films via laser drilling and plasma etching for interfacing copper. Materials & Design, 210: 110114. doi:10.1016/j.matdes.2021.110114.

Cite as: https://hdl.handle.net/21.11116/0000-0009-2E5D-D

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