STM observations of the initial stages of copper deposition on gold 
single-crystal electrodes

Nichols, R. J.; Kolb, Dieter M.; Behm, R. J.

doi:10.1016/0022-0728(91)85174-N

Item

ITEM ACTIONSEXPORT

Add to Basket

Local TagsRelease HistoryDetailsSummary

Released

Journal Article

STM observations of the initial stages of copper deposition on gold single-crystal electrodes

MPS-Authors

/persons/resource/persons260023

Nichols, R. J.
Fritz Haber Institute, Max Planck Society;

/persons/resource/persons196995

Kolb, Dieter M.
Physical Chemistry, Fritz Haber Institute, Max Planck Society;

External Resource

No external resources are shared

Fulltext (restricted access)

There are currently no full texts shared for your IP range.

Fulltext (public)

There are no public fulltexts stored in PuRe

Supplementary Material (public)

There is no public supplementary material available

Citation

Nichols, R. J., Kolb, D. M., & Behm, R. J. (1991). STM observations of the initial stages of copper deposition on gold single-crystal electrodes. Journal of Electroanalytical Chemistry, 313(1-2), 109-119. doi:10.1016/0022-0728(91)85174-N.

Cite as: https://hdl.handle.net/21.11116/0000-000A-5B31-9

Abstract

Scanning tunneling microscopy has been used in situ and in real time to follow the progress of copper electrocrystallization on Au(111). Initially deposition occurs at step edges, dislocations and defects in the substrate surface. At longer times, deposition is also observed on flat terraced regions of the surface. Typically the rate of growth of the deposit is far faster in the x and y directions than it is in the z direction. As expected, the copper deposit redissolves at potentials positive of the Nernst potential, and the surface generally returns close to the state it was in before the bulk copper deposition. However, small amounts of tenaciously held deposit sometimes remain, and these redissolve more slowly and at more positive potentials.