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Abstract

Barium titanate is a brittle, lead free ferroelectric and piezoelectric ceramic used in patterned and thin film forms in micro- and nano-scale electronic devices. Both during deposition and eventually during service, this material system develops stresses due to different loads acting on the system, which can lead to its failure due to cracking in the films and/or interface delamination. In situ microcantilever bending based fracture experiments and tensile tests based on shear lag tests in combination with digital image correlation were used to understand the cracking behavior of barium titanate films when deposited on flexible substrates. For the first time, the fracture behavior of these nanocrystalline barium titanate films has been quantified in terms of fracture toughness, fracture strength, and interface shear stresses for different film thicknesses. Critical defect size is estimated using the above information as a function of film thickness. It is found that damage tolerance in terms of fracture strength depends on film thickness. Furthermore, compared to a bulk single crystal, barium titanate fracture resistance of the nanocrystalline thin films is reduced. Both effects need to be considered in engineering design of reliable devices employing micro- and nano-scale barium titanate thin film structures.