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Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary

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/persons/resource/persons265177

Pemma,  Swetha
Atomistic Modelling of Material Interfaces, Project Groups, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons263259

Brink,  Tobias
Atomistic Modelling of Material Interfaces, Project Groups, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons75388

Dehm,  Gerhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Pemma, S., Brink, T., Janisch, R., & Dehm, G. (2022). Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Talk presented at Materials Science and Engineering Congress 2022. Darmstadt, Germany. 2022-09-27 - 2022-09-29.


Cite as: https://hdl.handle.net/21.11116/0000-000B-49D3-5
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