Investigation of Electromigration in Cu Interconnects by Noise Measurements

Emelianov, V.; Ganesam, G.; Puzic, A.; Schulz, S.; Habermeier, H.-U.; Stoll, H.

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Investigation of Electromigration in Cu Interconnects by Noise Measurements

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Habermeier, H.-U.
Scientific Facility Thin Film Technology (Gennady Logvenov), Max Planck Institute for Solid State Research, Max Planck Society;
Department Solid State Spectroscopy (Bernhard Keimer), Max Planck Institute for Solid State Research, Max Planck Society;
Department Physical Chemistry of Solids (Joachim Maier), Max Planck Institute for Solid State Research, Max Planck Society;

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Emelianov, V., Ganesam, G., Puzic, A., Schulz, S., Habermeier, H.-U., & Stoll, H. (2003). Investigation of Electromigration in Cu Interconnects by Noise Measurements. Proceedings of SPIE, 5112, 271-281.

Cite as: https://hdl.handle.net/21.11116/0000-000E-E84F-5

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