Patterned electroless deposition of copper by immobilization with microcontact 
printing of Palladium (II) complexes on Titanium-covered surfaces

Kind, H.; Geissler, M.; Biebuyck, H.; Schmid, H.; Michel, B.; Kern, K.; Delamarche, E.

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Patterned electroless deposition of copper by immobilization with microcontact printing of Palladium (II) complexes on Titanium-covered surfaces

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Schmid, H.
Scientific Facility Stuttgart Center for Electron Microscopy (Peter A. van Aken), Max Planck Institute for Solid State Research, Max Planck Society;
Department Physical Chemistry of Solids (Joachim Maier), Max Planck Institute for Solid State Research, Max Planck Society;

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Kern, K.
Department Nanoscale Science (Klaus Kern), Max Planck Institute for Solid State Research, Max Planck Society;

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Kind, H., Geissler, M., Biebuyck, H., Schmid, H., Michel, B., Kern, K., et al. (2000). Patterned electroless deposition of copper by immobilization with microcontact printing of Palladium (II) complexes on Titanium-covered surfaces. Langmuir, 16, 6367-6373.

Cite as: https://hdl.handle.net/21.11116/0000-000E-EB67-6

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