English
 
Help Privacy Policy Disclaimer
  Advanced SearchBrowse

Item

ITEM ACTIONSEXPORT

Released

Journal Article

Decoupling the electrical resistivity contribution of grain boundaries in dilute Fe-alloyed Cu thin films

MPS-Authors
/persons/resource/persons255130

Bishara,  Hanna
Thin Films and Nanostructured Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Department of Material Science and Engineering, Tel Aviv University, Ramat Aviv 6997801, Tel Aviv, Israel;

/persons/resource/persons263255

Langenohl,  Lena
Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons249272

Zhou,  Xuyang
Atom Probe Tomography, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons185411

Gault,  Baptiste
Atom Probe Tomography, Microstructure Physics and Alloy Design, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Imperial College, Royal School of Mines, Department of Materials, London, SW7 2AZ, UK;

/persons/resource/persons206627

Best,  James P.
Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Thin Films and Nanostructured Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

/persons/resource/persons75388

Dehm,  Gerhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

External Resource
No external resources are shared
Fulltext (restricted access)
There are currently no full texts shared for your IP range.
Fulltext (public)

1-s2.0-S1359646223001173-main.pdf
(Publisher version), 6MB

Supplementary Material (public)
There is no public supplementary material available
Citation

Bishara, H., Langenohl, L., Zhou, X., Gault, B., Best, J. P., & Dehm, G. (2023). Decoupling the electrical resistivity contribution of grain boundaries in dilute Fe-alloyed Cu thin films. Scripta Materialia, 230: 115393. doi:10.1016/j.scriptamat.2023.115393.


Cite as: https://hdl.handle.net/21.11116/0000-000C-D9F2-E
Abstract
There is no abstract available