English
 
Help Privacy Policy Disclaimer
  Advanced SearchBrowse
  1. View item / 
  2. Item Summary

Item

ITEM ACTIONSEXPORT
Add to Basket
  Local TagsRelease HistoryDetailsSummary

Released
Talk

Progress in the development of tungsten fibre-reinforced copper composites for heat sink applications in plasma-facing components

MPS-Authors
/persons/resource/persons144725

Müller,  A. von       
Plasma Edge and Wall (E2M), Max Planck Institute for Plasma Physics, Max Planck Society;
Office of the Director (DI), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons204426

Fuhr,  M.
Plasma Edge and Wall (E2M), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons240029

Hunger,  K.
Plasma Edge and Wall (E2M), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons109529

Junghanns,  P.
Plasma Edge and Wall (E2M), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons110046

Neu,  R.       
Plasma Edge and Wall (E2M), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons130799

Riesch,  J.       
Plasma Edge and Wall (E2M), Max Planck Institute for Plasma Physics, Max Planck Society;

/persons/resource/persons110851

You,  J.-H.
Plasma Edge and Wall (E2M), Max Planck Institute for Plasma Physics, Max Planck Society;

External Resource
No external resources are shared
Fulltext (restricted access)
There are currently no full texts shared for your IP range.
Fulltext (public)
There are no public fulltexts stored in PuRe
Supplementary Material (public)
There is no public supplementary material available
Citation

Müller, A. v., Fuhr, M., Hunger, K., Junghanns, P., Neu, R., Riesch, J., et al. (2023). Progress in the development of tungsten fibre-reinforced copper composites for heat sink applications in plasma-facing components. Talk presented at TMS 2023 Annual Meeting & Exhibition. San Diego, CA. 2023-03-19 - 2023-03-23.


Cite as: https://hdl.handle.net/21.11116/0000-000D-3B4A-F
Abstract
There is no abstract available