Corrosion-Resistant Ultrathin Cu Film Deposited on N-Doped Amorphous Carbon 
Film Substrate and Its Use for Crumpleable Circuit Board

Shim, Chae-Eun; Lee, Sangseob; Kong, Minsik; Kim, Ik-Soo; Kwak, Jaeik; Jang, Woosun; Jeong, Se-Young; Kim, Dong Wook; Soon, Aloysius; Jeong, Unyong

doi:10.1002/advs.202403587

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Corrosion-Resistant Ultrathin Cu Film Deposited on N-Doped Amorphous Carbon Film Substrate and Its Use for Crumpleable Circuit Board

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Kim, Dong Wook
Dept. Physical Intelligence, Max Planck Institute for Intelligent Systems, Max Planck Society;

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https://doi.org/10.1002/advs.202403587
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Shim, C.-E., Lee, S., Kong, M., Kim, I.-S., Kwak, J., Jang, W., et al. (2024). Corrosion-Resistant Ultrathin Cu Film Deposited on N-Doped Amorphous Carbon Film Substrate and Its Use for Crumpleable Circuit Board. Advanced Science, 11(40): 2403587. doi:10.1002/advs.202403587.

Cite as: https://hdl.handle.net/21.11116/0000-0010-4609-6

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