date: 2018-09-03T13:44:02Z pdf:PDFVersion: 1.5 pdf:docinfo:title: Thermal Characterization of Dynamic Silicon Cantilever Array Sensors by Digital Holographic Microscopy xmp:CreatorTool: LaTeX with hyperref package access_permission:can_print_degraded: true subject: In this paper, we apply a digital holographic microscope (DHM) in conjunction with stroboscopic acquisition synchronization. Here, the temperature-dependent decrease of the first resonance frequency (S1(T)) and Young?s elastic modulus (E1(T)) of silicon micromechanical cantilever sensors (MCSs) are measured. To perform these measurements, the MCSs are uniformly heated from T0 = 298 K to T = 450 K while being externally actuated with a piezo-actuator in a certain frequency range close to their first resonance frequencies. At each temperature, the DHM records the time-sequence of the 3D topographies for the given frequency range. Such holographic data allow for the extracting of the out-of-plane vibrations at any relevant area of the MCSs. Next, the Bode and Nyquist diagrams are used to determine the resonant frequencies with a precision of 0.1 Hz. Our results show that the decrease of resonance frequency is a direct consequence of the reduction of the silicon elastic modulus upon heating. The measured temperature dependence of the Young?s modulus is in very good accordance with the previously-reported values, validating the reliability and applicability of this method for micromechanical sensing applications. dc:format: application/pdf; version=1.5 pdf:docinfo:creator_tool: LaTeX with hyperref package access_permission:fill_in_form: true pdf:encrypted: false dc:title: Thermal Characterization of Dynamic Silicon Cantilever Array Sensors by Digital Holographic Microscopy modified: 2018-09-03T13:44:02Z cp:subject: In this paper, we apply a digital holographic microscope (DHM) in conjunction with stroboscopic acquisition synchronization. Here, the temperature-dependent decrease of the first resonance frequency (S1(T)) and Young?s elastic modulus (E1(T)) of silicon micromechanical cantilever sensors (MCSs) are measured. To perform these measurements, the MCSs are uniformly heated from T0 = 298 K to T = 450 K while being externally actuated with a piezo-actuator in a certain frequency range close to their first resonance frequencies. At each temperature, the DHM records the time-sequence of the 3D topographies for the given frequency range. Such holographic data allow for the extracting of the out-of-plane vibrations at any relevant area of the MCSs. Next, the Bode and Nyquist diagrams are used to determine the resonant frequencies with a precision of 0.1 Hz. Our results show that the decrease of resonance frequency is a direct consequence of the reduction of the silicon elastic modulus upon heating. The measured temperature dependence of the Young?s modulus is in very good accordance with the previously-reported values, validating the reliability and applicability of this method for micromechanical sensing applications. pdf:docinfo:subject: In this paper, we apply a digital holographic microscope (DHM) in conjunction with stroboscopic acquisition synchronization. Here, the temperature-dependent decrease of the first resonance frequency (S1(T)) and Young?s elastic modulus (E1(T)) of silicon micromechanical cantilever sensors (MCSs) are measured. To perform these measurements, the MCSs are uniformly heated from T0 = 298 K to T = 450 K while being externally actuated with a piezo-actuator in a certain frequency range close to their first resonance frequencies. At each temperature, the DHM records the time-sequence of the 3D topographies for the given frequency range. Such holographic data allow for the extracting of the out-of-plane vibrations at any relevant area of the MCSs. Next, the Bode and Nyquist diagrams are used to determine the resonant frequencies with a precision of 0.1 Hz. Our results show that the decrease of resonance frequency is a direct consequence of the reduction of the silicon elastic modulus upon heating. The measured temperature dependence of the Young?s modulus is in very good accordance with the previously-reported values, validating the reliability and applicability of this method for micromechanical sensing applications. pdf:docinfo:creator: Marjan Zakerin, Antonin Novak, Masaya Toda, Yves Emery, Filipe Natalio, Hans-Jürgen Butt and Rüdiger Berger PTEX.Fullbanner: This is pdfTeX, Version 3.14159265-2.6-1.40.15 (TeX Live 2014/W32TeX) kpathsea version 6.2.0 meta:author: Marjan Zakerin, Antonin Novak, Masaya Toda, Yves Emery, Filipe Natalio, Hans-Jürgen Butt and Rüdiger Berger trapped: False meta:creation-date: 2017-05-23T08:21:03Z created: 2017-05-23T08:21:03Z access_permission:extract_for_accessibility: true Creation-Date: 2017-05-23T08:21:03Z Author: Marjan Zakerin, Antonin Novak, Masaya Toda, Yves Emery, Filipe Natalio, Hans-Jürgen Butt and Rüdiger Berger producer: pdfTeX-1.40.15 pdf:docinfo:producer: pdfTeX-1.40.15 pdf:unmappedUnicodeCharsPerPage: 0 dc:description: In this paper, we apply a digital holographic microscope (DHM) in conjunction with stroboscopic acquisition synchronization. Here, the temperature-dependent decrease of the first resonance frequency (S1(T)) and Young?s elastic modulus (E1(T)) of silicon micromechanical cantilever sensors (MCSs) are measured. To perform these measurements, the MCSs are uniformly heated from T0 = 298 K to T = 450 K while being externally actuated with a piezo-actuator in a certain frequency range close to their first resonance frequencies. At each temperature, the DHM records the time-sequence of the 3D topographies for the given frequency range. Such holographic data allow for the extracting of the out-of-plane vibrations at any relevant area of the MCSs. Next, the Bode and Nyquist diagrams are used to determine the resonant frequencies with a precision of 0.1 Hz. Our results show that the decrease of resonance frequency is a direct consequence of the reduction of the silicon elastic modulus upon heating. The measured temperature dependence of the Young?s modulus is in very good accordance with the previously-reported values, validating the reliability and applicability of this method for micromechanical sensing applications. Keywords: digital holography; micromechanical cantilever sensors; thermal load; temperature coefficient of resonance frequency; temperature coefficient of elastic modulus access_permission:modify_annotations: true dc:creator: Marjan Zakerin, Antonin Novak, Masaya Toda, Yves Emery, Filipe Natalio, Hans-Jürgen Butt and Rüdiger Berger description: In this paper, we apply a digital holographic microscope (DHM) in conjunction with stroboscopic acquisition synchronization. Here, the temperature-dependent decrease of the first resonance frequency (S1(T)) and Young?s elastic modulus (E1(T)) of silicon micromechanical cantilever sensors (MCSs) are measured. To perform these measurements, the MCSs are uniformly heated from T0 = 298 K to T = 450 K while being externally actuated with a piezo-actuator in a certain frequency range close to their first resonance frequencies. At each temperature, the DHM records the time-sequence of the 3D topographies for the given frequency range. Such holographic data allow for the extracting of the out-of-plane vibrations at any relevant area of the MCSs. Next, the Bode and Nyquist diagrams are used to determine the resonant frequencies with a precision of 0.1 Hz. Our results show that the decrease of resonance frequency is a direct consequence of the reduction of the silicon elastic modulus upon heating. The measured temperature dependence of the Young?s modulus is in very good accordance with the previously-reported values, validating the reliability and applicability of this method for micromechanical sensing applications. dcterms:created: 2017-05-23T08:21:03Z Last-Modified: 2018-09-03T13:44:02Z dcterms:modified: 2018-09-03T13:44:02Z title: Thermal Characterization of Dynamic Silicon Cantilever Array Sensors by Digital Holographic Microscopy xmpMM:DocumentID: uuid:5b580e85-15c2-4760-ba2f-6d1f77924539 Last-Save-Date: 2018-09-03T13:44:02Z pdf:docinfo:keywords: digital holography; micromechanical cantilever sensors; thermal load; temperature coefficient of resonance frequency; temperature coefficient of elastic modulus pdf:docinfo:modified: 2018-09-03T13:44:02Z meta:save-date: 2018-09-03T13:44:02Z pdf:docinfo:custom:PTEX.Fullbanner: This is pdfTeX, Version 3.14159265-2.6-1.40.15 (TeX Live 2014/W32TeX) kpathsea version 6.2.0 Content-Type: application/pdf X-Parsed-By: org.apache.tika.parser.DefaultParser creator: Marjan Zakerin, Antonin Novak, Masaya Toda, Yves Emery, Filipe Natalio, Hans-Jürgen Butt and Rüdiger Berger dc:subject: digital holography; micromechanical cantilever sensors; thermal load; temperature coefficient of resonance frequency; temperature coefficient of elastic modulus access_permission:assemble_document: true xmpTPg:NPages: 11 pdf:charsPerPage: 2863 access_permission:extract_content: true access_permission:can_print: true pdf:docinfo:trapped: False meta:keyword: digital holography; micromechanical cantilever sensors; thermal load; temperature coefficient of resonance frequency; temperature coefficient of elastic modulus access_permission:can_modify: true pdf:docinfo:created: 2017-05-23T08:21:03Z