Speciation of Copper(II)-Betaine Complexes as Starting Point for 
Electrochemical Copper Deposition from Ionic Liquids

Richter, Janine; Knies, Maximilian; Ruck, Michael

doi:10.1002/open.202000231

Item

ITEM ACTIONSEXPORT

Add to Basket

Local TagsRelease HistoryDetailsSummary

Released

Journal Article

Speciation of Copper(II)-Betaine Complexes as Starting Point for Electrochemical Copper Deposition from Ionic Liquids

MPS-Authors

/persons/resource/persons126823

Ruck, Michael
Michael Ruck, Max Planck Fellow, Max Planck Institute for Chemical Physics of Solids, Max Planck Society;

External Resource

No external resources are shared

Fulltext (restricted access)

There are currently no full texts shared for your IP range.

Fulltext (public)

There are no public fulltexts stored in PuRe

Supplementary Material (public)

There is no public supplementary material available

Citation

Richter, J., Knies, M., & Ruck, M. (2021). Speciation of Copper(II)-Betaine Complexes as Starting Point for Electrochemical Copper Deposition from Ionic Liquids. ChemistryOpen, 10(2), 97-109. doi:10.1002/open.202000231.

Cite as: https://hdl.handle.net/21.11116/0000-0007-8915-7

Abstract

The application of ionic liquids for the dissolution of metal oxides is a promising field for the development of more energy- and resource-efficient metallurgical processes. Using such solutions for the production of valuable chemicals or electrochemical metal deposition requires a detailed understanding of the chemical system and the factors influencing it. In the present work, several compounds are reported that crystallize after the dissolution of copper(II) oxide in the ionic liquid [Hbet][NTf2]. Dependent on the initial amount of chloride, the reaction temperature and the purity of the reagent, copper crystallizes in complexes with varying coordination geometries and ligands. Subsequently, the influence of these different complex species on electrochemical properties is shown. For the first time, copper is deposited from the ionic liquid [Hbet][NTf2], giving promising opportunities for more resource-efficient copper plating. The copper coatings were analyzed by SEM and EDX measurements. Furthermore, a mechanism for the decomposition of [Hbet][NTf2] in the presence of chloride is suggested and supported by experimental evidence. © 2020 The Authors. Published by Wiley-VCH GmbH