date: 2021-03-25T10:48:54Z
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pdf:docinfo:title: Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu
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dc:title: Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu
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Author: Hanna Bishara, Matteo Ghidelli, and Gerhard Dehm
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Keywords: grain boundary,interface,electrical resistivity,thin films,copper
pdf:docinfo:custom:prism:doi: 10.1021/acsaelm.0c00311
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dc:creator: Hanna Bishara, Matteo Ghidelli, and Gerhard Dehm
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title: Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu
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creator: Hanna Bishara, Matteo Ghidelli, and Gerhard Dehm
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