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学術論文

Microfabrication through self-ordering of cracks : mechanism, upscaling and application for transparent electrodes

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Odziomek,  Mateusz       
Mateusz Odziomek, Kolloidchemie, Max Planck Institute of Colloids and Interfaces, Max Planck Society;

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引用

Thorimbert, F., Brachfeld, A., Odziomek, M., Boissière, C., Amenitsch, H., Naumenko, D., Mattana, G., Baccile, N., & Faustini, M. (2024). Microfabrication through self-ordering of cracks: mechanism, upscaling and application for transparent electrodes. Advanced Materials Technologies,. doi:10.1002/admt.202400353.


引用: https://hdl.handle.net/21.11116/0000-000F-588D-0
要旨
When drying a colloidal solution, cracks appear in the resulting colloidal film. In certain cases, spontaneous order is observed, and cracks form arrays of periodic patterns. Although this phenomenon might be envisioned as a patterning method, overcoming practical challenges is necessary to transform it into a technological tool for microfabrication. This study explores various technological aspects aimed at leveraging the self-assembly of cracks as a scalable microfabrication tool for large-scale device production. Through a series of analyses, including time-resolved Grazing-Incidence Small-Angle X-Ray Scattering (GISAXS), it is offered novel insights into controlling the crack self-ordering mechanism, minimizing defects, and implementing strategies for large-scale patterning and pattern transfer. The process proves to be surprisingly robust, maintaining its efficacy with the same colloidal solution even after two years. By introducing biphasic dip-coating, large-scale crack patterns up to 100 cm2, while preserving their periodicity and ordering is achieved. As a proof of concept, the use of crack-patterned colloidal films as masks for fabricating metallic sub-micrometer objects, that serve as transparent electrodes with adjustable transparency and conductivity is showcased. Overall, this method presents significant advantages over conventional lithography, being cost-effective, versatile, environmentally friendly, and scalable, thereby offering new perspectives for diverse applications requiring cost-effective and large-scale patterning.