Parametric and Reduced-Order Modeling for the Thermal Analysis of 
Nanoelectronic Structures

Feng, Lihong; Meuris, Peter; Schoenmaker, Wim; Benner, Peter

doi:10.1007/978-3-319-30399-4_16

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Parametric and Reduced-Order Modeling for the Thermal Analysis of Nanoelectronic Structures

Feng, L., Meuris, P., Schoenmaker, W., & Benner, P. (2016). Parametric and Reduced-Order Modeling for the Thermal Analysis of Nanoelectronic Structures. In A. Bartel, M. Clemens, M. Günther, & E. J. W. ter Maten (Eds.), Scientific Computing in Electrical Engineering (pp. 155-163). Switzerland: Springer International Publishing.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-002A-EF52-B Version Permalink: https://hdl.handle.net/11858/00-001M-0000-002D-A3E9-9

Genre: Book Chapter

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Creators:
Feng, Lihong¹, Author
Meuris, Peter², Author
Schoenmaker, Wim², Author
Benner, Peter¹, Author

Affiliations:
1Computational Methods in Systems and Control Theory, Max Planck Institute for Dynamics of Complex Technical Systems, Max Planck Society, ou_1738141
2Magwel NV, Leuven, ou_persistent22

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Dates: Date issued: 2016

Publication Status: Issued

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Identifiers: DOI: 10.1007/978-3-319-30399-4_16

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Project name : nanoCOPS - Nanoelectronic COupled Problems Solutions

Grant ID : 619166

Funding program : Funding Programme 7 (FP7)

Funding organization : European Commission (EC)

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Title: Scientific Computing in Electrical Engineering

Subtitle : SCEE 2014, Wuppertal, Germany, July 2014

Source Genre: Book

Creator(s):
Bartel, Andreas, Editor
Clemens, Markus, Editor
Günther, Michael, Editor
ter Maten, E. Jan W., Editor

Affiliations:
-

Publ. Info: Switzerland : Springer International Publishing

Pages: - Volume / Issue: - Sequence Number: - Start / End Page: 155 - 163 Identifier: ISBN: 978-3-319-30398-7

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Title: Mathematics in Industry / The European Consortium for Mathematics in Industry

Source Genre: Series

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Publ. Info: Switzerland : Springer International Publishing

Pages: - Volume / Issue: 23 Sequence Number: - Start / End Page: - Identifier: ISSN: 1612-3956