Passivation Effects in Copper Thin Films

Wiederhirn, Guillaume; Balk, Thomas John; Dehm, Gerhard; Nucci, Julie A.; Richter, Gunther; Arzt, Eduard

doi:10.1063/1.2173548

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Passivation Effects in Copper Thin Films

Wiederhirn, G., Balk, T. J., Dehm, G., Nucci, J. A., Richter, G., & Arzt, E. (2006). Passivation Effects in Copper Thin Films. AIP Conference Proceedings, 817, 185-191.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0024-51AE-B Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0024-51AF-9

Genre: Conference Paper

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Creators:
Wiederhirn, Guillaume¹, Author
Balk, Thomas John², Author
Dehm, Gerhard³, Author
Nucci, Julie A.¹, Author
Richter, Gunther⁴, Author
Arzt, Eduard¹, Author

Affiliations:
1Former Dept. Micro/Nanomechanics of Thin Films and Biological Systems, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497655
2University of Kentucky, Department of Chemical and Materials Engineering, Lexington, USA, ou_persistent22
3Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22
4Former Dept. Microstructure Interfaces, Max Planck Institute for Intelligent Systems, Max Planck Society, ou_1497657

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Language(s): eng - English

Dates: Date issued: 2006-02-07

Publication Status: Issued

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Identifiers: DOI: 10.1063/1.2173548

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Title: 8th International Workshop on Stress-Induced Phenomena in Metallization

Place of Event: Dresden; Germany

Start-/End Date: 2005-09-12 - 2005-09-14

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Title: AIP Conference Proceedings

Abbreviation : AIP Conf. Proc.

Source Genre: Journal

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Publ. Info: Melville, NY : AIP Publishing

Pages: - Volume / Issue: 817 Sequence Number: - Start / End Page: 185 - 191 Identifier: ISSN: 0094-243X
CoNE: https://pure.mpg.de/cone/journals/resource/954928528968