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  Micromechanical testing of lead-free solder joints in microelectronics

Philippi, B., Schießl, A., Schingale, A., & Dehm, G. (2014). Micromechanical testing of lead-free solder joints in microelectronics. Talk presented at Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, MPI für Eisenforschung GmbH. Düsseldorf, Deutschland. 2014-02-27 - 2014-02-28.

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 Creators:
Philippi, Bastian1, 2, Author           
Schießl, Andreas3, Author           
Schingale, Angelika3, Author           
Dehm, Gerhard1, Author           
Affiliations:
1Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              
2Materials Center Leoben Forschung GmbH, Roseggerstraße 12, 8700 Leoben, Austria, ou_persistent22              
3Continental Automotive GmbH, Siemensstraße 12, 93055 Regensburg, Germany, ou_persistent22              

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Language(s): eng - English
 Dates: 2014
 Publication Status: Not specified
 Pages: -
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Title: Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, MPI für Eisenforschung GmbH
Place of Event: Düsseldorf, Deutschland
Start-/End Date: 2014-02-27 - 2014-02-28

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