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Micromechanical testing of lead-free solder joints in microelectronics

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Philippi,  Bastian
Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;
Materials Center Leoben Forschung GmbH, Roseggerstraße 12, 8700 Leoben, Austria;

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Dehm,  Gerhard
Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Philippi, B., Schießl, A., Schingale, A., & Dehm, G. (2014). Micromechanical testing of lead-free solder joints in microelectronics. Talk presented at Arbeitskreistreffen Rasterkraftmikroskopie und nanomechanische Methoden, MPI für Eisenforschung GmbH. Düsseldorf, Deutschland. 2014-02-27 - 2014-02-28.


Cite as: https://hdl.handle.net/11858/00-001M-0000-0023-C363-6
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