Micromechanical investigation of solder joints for automotive microelectronics

Philippi, Bastian; Schießl, Andreas; Schingale, Angelika; Dehm, Gerhard

Local TagsRelease HistoryDetailsSummary

Micromechanical investigation of solder joints for automotive microelectronics

Philippi, B., Schießl, A., Schingale, A., & Dehm, G. (2013). Micromechanical investigation of solder joints for automotive microelectronics. Poster presented at Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão Algarve, Portugal.

Item is Released

show all hide all

Basic

show hide

Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0023-C35D-5 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0023-C35E-3

Genre: Poster

Files

show Files

Locators

show

Creators

show

hide

Creators:
Philippi, Bastian^{1, 2}, Author
Schießl, Andreas³, Author
Schingale, Angelika³, Author
Dehm, Gerhard¹, Author

Affiliations:
1Structure and Micro-/Nanomechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398
2Materials Center Leoben Forschung GmbH, Roseggerstraße 12, 8700 Leoben, Austria, ou_persistent22
3Continental Automotive GmbH, Siemensstraße 12, 93055 Regensburg, Germany, ou_persistent22

Content

show

Details

show

hide

Language(s): eng - English

Dates: Created: 2013

Publication Status: Not specified

Pages: -

Publishing info: -

Table of Contents: -

Rev. Type: -

Identifiers: -

Degree: -

Event

show

hide

Title: Nano- and Micromechanical Testing in Materials Research and Development IV

Place of Event: Olhão Algarve, Portugal

Start-/End Date: 2013-10-06 - 2013-10-11

Legal Case

show

Project information

show

Source

show