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  In situ investigation of the interlayer dominated failure of Cu thin films for flexible electronic devices

Marx, V. M., Toth, F., Wiesinger, A., Berger, J., Kirchlechner, C., Cordill, M. J., et al. (2014). In situ investigation of the interlayer dominated failure of Cu thin films for flexible electronic devices. Poster presented at Gordon Research Conference “Thin Film and Small Scale Mechanical Behavior”, Bentley University, Waltham, Waltham, MA, USA.

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 Creators:
Marx, Vera Maria1, Author           
Toth, Florian2, Author           
Wiesinger, Andreas2, Author           
Berger, Julia3, Author           
Kirchlechner, Christoph4, Author           
Cordill, Megan Jo5, Author           
Rammerstorfer, Franz Georg3, Author           
Dehm, Gerhard6, Author           
Affiliations:
1Advanced Transmission Electron Microscopy, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863399              
2Institute of Lightweight Design and Structural Biomechanics, Vienna University of Technology, Gußhausstr. 27-29, Vienna, Austria, ou_persistent22              
3Department Material Physics, Montanuniversität Leoben, Jahnstr. 12, Leoben, Austria, ou_persistent22              
4Nano-/ Micromechanics of Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863401              
5Erich Schmid Institute of Materials Science, Leoben, Austria, ou_persistent22              
6Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Language(s): eng - English
 Dates: 2014-07
 Publication Status: Not specified
 Pages: -
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 Table of Contents: -
 Rev. Type: -
 Identifiers: -
 Degree: -

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Title: Gordon Research Conference “Thin Film and Small Scale Mechanical Behavior”, Bentley University, Waltham
Place of Event: Waltham, MA, USA
Start-/End Date: 2014-07-13 - 2014-07-18

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