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  Interfacial Fracture Behavior of Tungsten Wire/Tungsten Matrix Composites with Copper-Coated Interfaces

Du, J., Höschen, T., Rasinski, M., & You, J. H. (2010). Interfacial Fracture Behavior of Tungsten Wire/Tungsten Matrix Composites with Copper-Coated Interfaces. Materials Science and Engineering A, 527(6), 1623-1629. doi:10.1016/j.msea.2009.10.046.

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Item Permalink: https://hdl.handle.net/11858/00-001M-0000-0026-EEE1-7 Version Permalink: https://hdl.handle.net/11858/00-001M-0000-0026-EEE2-5
Genre: Journal Article

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 Creators:
Du, J.1, Author           
Höschen, T.1, Author           
Rasinski, M.1, Author           
You, J. H.1, Author           
Affiliations:
1Material Research (MF), Max Planck Institute for Plasma Physics, Max Planck Society, ou_1856328              

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Language(s): eng - English
 Dates: 2010
 Publication Status: Issued
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: eDoc: 436360
DOI: 10.1016/j.msea.2009.10.046
URI: http://dx.doi.org/10.1016/j.msea.2009.10.046
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Title: Materials Science and Engineering A
Source Genre: Journal
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Publ. Info: Elsevier B.V.
Pages: - Volume / Issue: 527 (6) Sequence Number: - Start / End Page: 1623 - 1629 Identifier: -