Yield stress influenced by the ratio of wire diameter to grain size – a 
competition between the effects of specimen microstructure and dimension in 
micro-sized polycrystalline copper wires

Yang, Bo; Motz, Christian; Rester, Martin; Dehm, Gerhard

doi:10.1080/14786435.2012.693215

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Yield stress influenced by the ratio of wire diameter to grain size – a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires

Yang, B., Motz, C., Rester, M., & Dehm, G. (2012). Yield stress influenced by the ratio of wire diameter to grain size – a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires. Philosophical Magazine Letters; Nano-mechanical testing in materials research and development III, 92(25-27), 3243-3256. doi:10.1080/14786435.2012.693215.

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Item Permalink: https://hdl.handle.net/21.11116/0000-0001-8BD9-E Version Permalink: https://hdl.handle.net/21.11116/0000-0001-8BDA-D

Genre: Journal Article

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Creators:
Yang, Bo^{1, 2}, Author
Motz, Christian², Author
Rester, Martin³, Author
Dehm, Gerhard^{2, 4}, Author

Affiliations:
1Materials Center Leoben, Forschungs GmbH, Leoben, Austria, ou_persistent22
2Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Leoben, Austria, ou_persistent22
3Department of Materials Physics, Montanuniversität Leoben, Leoben, Austria, ou_persistent22
4Department of Materials Physics, Montanuniversität Leoben, Austria, ou_persistent22

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Language(s): eng - English

Dates: Date issued: 2012-09-01

Publication Status: Issued

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Rev. Type: Peer

Identifiers: DOI: 10.1080/14786435.2012.693215

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Title: Philosophical Magazine Letters; Nano-mechanical testing in materials research and development III

Abbreviation : Philos. Mag. Lett.

Source Genre: Journal

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Pages: - Volume / Issue: 92 (25-27) Sequence Number: - Start / End Page: 3243 - 3256 Identifier: ISSN: 0950-0839
CoNE: https://pure.mpg.de/cone/journals/resource/954925271392