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  Modeling RF-induced power deposition and temperature rise of coaxial leads with helical wires

Kozlov, M., Horner, M., & Kainz, W. (2019). Modeling RF-induced power deposition and temperature rise of coaxial leads with helical wires. In Proceedings of the 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) 2019 (pp. 1895-1898). doi:10.1109/EMBC.2019.8856572.

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Genre: Konferenzbeitrag

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 Urheber:
Kozlov, Mikhail1, Autor           
Horner, Marc2, Autor
Kainz, Wolfgang3, Autor
Affiliations:
1Department Neurophysics (Weiskopf), MPI for Human Cognitive and Brain Sciences, Max Planck Society, ou_2205649              
2ANSYS, Inc., Evanston, IL, ou_persistent22              
3Division of Biomedical Physics, Office of Science and Engineering Laboratories, Silver Spring, MD, ou_persistent22              

Inhalt

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Schlagwörter: Lead; Electrodes; Radio frequency; Wires; Antennas; Computational modeling; Solid modeling
 Zusammenfassung: The lead electromagnetic model (LEM) and the radiofrequency responses, i.e., the net dissipated electrode power and net temperature increase, above background, at the electrodes, were modelled for two coax-type insulated leads with inner and outer helical wires with a pitch of 0.35 mm. The quotient of the variances of the fitted LEM values and observed values (R 2 ) of the radiofrequency responses was substantially different for the lead electrode versus the ring electrode, where R 2 of the ring quotient was a function of the duration of the RF-induced heating.

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Sprache(n): eng - English
 Datum: 2019-10-07
 Publikationsstatus: Online veröffentlicht
 Seiten: -
 Ort, Verlag, Ausgabe: -
 Inhaltsverzeichnis: -
 Art der Begutachtung: Expertenbegutachtung
 Identifikatoren: DOI: 10.1109/EMBC.2019.8856572
 Art des Abschluß: -

Veranstaltung

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Titel: 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)
Veranstaltungsort: Berlin, Germany
Start-/Enddatum: 2019-07-23 - 2019-07-27

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Titel: Proceedings of the 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) 2019
Genre der Quelle: Konferenzband
 Urheber:
Affiliations:
Ort, Verlag, Ausgabe: -
Seiten: - Band / Heft: - Artikelnummer: - Start- / Endseite: 1895 - 1898 Identifikator: ISBN: 978-1-5386-1311-5