非表示:
キーワード:
-
要旨:
The underpotential deposition (UPD) of copper on to Pt(111) in the presence of chloride anions was studied by full-dynamical LEED-intensity analyses. A deformed (4×4) LEED pattern was observed at an emersion potential of 0.36 V vs. Ag/AgCl, right in between the two characteristic and well-separated peaks of the cyclic voltammogram (CV). Corresponding LEED intensity measurements and simulations of the integral-order beams indicate that the UPD of Cu forms a single pseudomorphic Cu layer on Pt(111).