Stress driven grain boundary migration for different complexions of a Cu tilt 
grain boundary

Pemma, Swetha; Brink, Tobias; Janisch, Rebecca; Dehm, Gerhard

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Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary

Pemma, S., Brink, T., Janisch, R., & Dehm, G. (2022). Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Talk presented at Materials Science and Engineering Congress 2022. Darmstadt, Germany. 2022-09-27 - 2022-09-29.

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Datensatz-Permalink: https://hdl.handle.net/21.11116/0000-000B-49D3-5 Versions-Permalink: https://hdl.handle.net/21.11116/0000-000B-49D4-4

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Urheber:
Pemma, Swetha¹, Autor
Brink, Tobias¹, Autor
Janisch, Rebecca², Autor
Dehm, Gerhard³, Autor

Affiliations:
1Atomistic Modelling of Material Interfaces, Project Groups, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_3291845
2Mechanical Properties of interfaces Department of Micromechanical and Macroscopic Modelling, ICAMS, Ruhr-Universität Bochum, Germany, ou_persistent22
3Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398