Stress driven grain boundary migration for different complexions of a Cu tilt 
grain boundary

Pemma, Swetha; Brink, Tobias; Janisch, Rebecca; Dehm, Gerhard

Local TagsRelease HistoryDetailsSummary

Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary

Pemma, S., Brink, T., Janisch, R., & Dehm, G. (2022). Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Talk presented at Materials Science and Engineering Congress 2022. Darmstadt, Germany. 2022-09-27 - 2022-09-29.

Item is Released

show all hide all

Basic

show hide

Item Permalink: https://hdl.handle.net/21.11116/0000-000B-49D3-5 Version Permalink: https://hdl.handle.net/21.11116/0000-000B-49D4-4

Genre: Talk

Files

show Files

Locators

show

Creators

show

hide

Creators:
Pemma, Swetha¹, Author
Brink, Tobias¹, Author
Janisch, Rebecca², Author
Dehm, Gerhard³, Author

Affiliations:
1Atomistic Modelling of Material Interfaces, Project Groups, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_3291845
2Mechanical Properties of interfaces Department of Micromechanical and Macroscopic Modelling, ICAMS, Ruhr-Universität Bochum, Germany, ou_persistent22
3Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398

Content

show

Details

show

hide

Language(s): eng - English

Dates: Created: 2022-09-28

Publication Status: Not specified

Pages: -

Publishing info: -

Table of Contents: -

Rev. Type: -

Identifiers: -

Degree: -

Event

show

hide

Title: Materials Science and Engineering Congress 2022

Place of Event: Darmstadt, Germany

Start-/End Date: 2022-09-27 - 2022-09-29

Legal Case

show

Project information

show

Source

show