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Conference Paper

Investigation of Electromigration in Copper Interconnects by Noise Measurements

MPS-Authors
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Puzic,  A.
Dept. Modern Magnetic Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

Habermeier,  H.-U.
Max Planck Society;

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Stoll,  H.
Former Central Scientific Facility ANKA Synchroton Beamline, Max Planck Institute for Intelligent Systems, Max Planck Society;
Dept. Modern Magnetic Systems, Max Planck Institute for Intelligent Systems, Max Planck Society;

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Citation

Emelianov, V., Ganesan, G., Puzic, A., Schulz, S., Eizenberg, M., Habermeier, H.-U., et al. (2003). Investigation of Electromigration in Copper Interconnects by Noise Measurements. In M. B. Weissmann, N. E. Israeloff, & A. S. Kogan (Eds.), Noise as a Tool for Studying Materials (pp. 271-281).


Cite as: http://hdl.handle.net/11858/00-001M-0000-0010-2EB1-5
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