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Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu

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Bishara,  Hanna
Thin Films and Nanostructured Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Ghidelli,  Matteo
Thin Films and Nanostructured Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Dehm,  Gerhard
Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society;

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Bishara, H., Ghidelli, M., & Dehm, G. (2020). Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu. ACS Applied Electronic Materials, 2(7), 2049-2056. doi:10.1021/acsaelm.0c00311.


Cite as: http://hdl.handle.net/21.11116/0000-0007-9E2B-8
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