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  Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu

Bishara, H., Ghidelli, M., & Dehm, G. (2020). Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu. ACS Applied Electronic Materials, 2(7), 2049-2056. doi:10.1021/acsaelm.0c00311.

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Genre: Journal Article

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 Creators:
Bishara, Hanna1, Author              
Ghidelli, Matteo1, Author              
Dehm, Gerhard2, Author              
Affiliations:
1Thin Films and Nanostructured Materials, Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_3274276              
2Structure and Nano-/ Micromechanics of Materials, Max-Planck-Institut für Eisenforschung GmbH, Max Planck Society, ou_1863398              

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Language(s): eng - English
 Dates: 2020-07-01
 Publication Status: Published in print
 Pages: -
 Publishing info: -
 Table of Contents: -
 Rev. Type: Peer
 Identifiers: DOI: 10.1021/acsaelm.0c00311
 Degree: -

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Title: ACS Applied Electronic Materials
  Other : ACS appl. electron. mater.
  Abbreviation : ACS AEM
Source Genre: Journal
 Creator(s):
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Publ. Info: -
Pages: - Volume / Issue: 2 (7) Sequence Number: - Start / End Page: 2049 - 2056 Identifier: ISSN: 2637-6113
CoNE: https://pure.mpg.de/cone/journals/resource/2637-6113